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path: root/drivers/mtd/nand/spi/winbond.c
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2020-03-09mtd: spinand: rework detect procedure for different READ_ID operationChuanhong Guo
Currently there are 3 different variants of read_id implementation: 1. opcode only. Found in GD5FxGQ4xF. 2. opcode + 1 addr byte. Found in GD5GxGQ4xA/E 3. opcode + 1 dummy byte. Found in other currently supported chips. Original implementation was for variant 1 and let detect function of chips with variant 2 and 3 to ignore the first byte. This isn't robust: 1. For chips of variant 2, if SPI master doesn't keep MOSI low during read, chip will get a random id offset, and the entire id buffer will shift by that offset, causing detect failure. 2. For chips of variant 1, if it happens to get a devid that equals to manufacture id of variant 2 or 3 chips, it'll get incorrectly detected. This patch reworks detect procedure to address problems above. New logic do detection for all variants separatedly, in 1-2-3 order. Since all current detect methods do exactly the same id matching procedure, unify them into core.c and remove detect method from manufacture_ops. Tested on GD5F1GQ4UAYIG and W25N01GVZEIG. Signed-off-by: Chuanhong Guo <gch981213@gmail.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Link: https://lore.kernel.org/linux-mtd/20200208074439.146296-1-gch981213@gmail.com
2019-04-08mtd: nand: Add max_bad_eraseblocks_per_lun info to memorgBoris Brezillon
NAND datasheets usually give the maximum number of bad blocks per LUN and this number can be used to help upper layers decide how much blocks they should reserve for bad block handling. Add a max_bad_eraseblocks_per_lun to the nand_memory_organization struct and update the NAND_MEMORG() macro (and its users) accordingly. We also provide a default mtd->_max_bad_blocks() implementation. Signed-off-by: Boris Brezillon <bbrezillon@kernel.org> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com> Reviewed-by: Frieder Schrempf <frieder.schrempf@kontron.de>
2018-11-05mtd: spinand: winbond: Add support for W25N01GVRobert Marko
W25N01GV is a single die version of the already supported W25M02GV with half the capacity. Everything else is the same so introduce support for W25N01GV. Datasheet:http://www.winbond.com/resource-files/w25n01gv%20revl%20050918%20unsecured.pdf Tested on 8devices Jalapeno dev board under OpenWrt running 4.19-rc5. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Boris Brezillon <boris.brezillon@bootlin.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>
2018-07-18mtd: spinand: Add initial support for Winbond W25M02GVFrieder Schrempf
Add support for the W25M02GV chip. Signed-off-by: Frieder Schrempf <frieder.schrempf@exceet.de> Signed-off-by: Boris Brezillon <boris.brezillon@bootlin.com> Signed-off-by: Miquel Raynal <miquel.raynal@bootlin.com>