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authorLukasz Majewski <l.majewski@samsung.com>2014-09-24 10:27:10 +0200
committerZhang Rui <rui.zhang@intel.com>2014-10-09 10:44:01 +0800
commit26bb0e9a1a938ec98ee07aa76533f1a711fba706 (patch)
tree0f17deb50d1cbfd45060c1da59d864ac143bdbfd /fs/fat/Makefile
parent52addcf9d6669fa439387610bc65c92fa0980cef (diff)
thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
It turns out that some boards can have instance->lower greater than 0 and when thermal trend is dropping it results with next_target equal to -1. Since the next_target is defined as unsigned long it is interpreted as 0xFFFFFFFF and larger than instance->upper. As a result the next_target is set to instance->upper which ramps up to maximal cooling device target when the temperature is steadily decreasing. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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