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author | Lukasz Majewski <l.majewski@samsung.com> | 2014-09-24 10:27:10 +0200 |
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committer | Zhang Rui <rui.zhang@intel.com> | 2014-10-09 10:44:01 +0800 |
commit | 26bb0e9a1a938ec98ee07aa76533f1a711fba706 (patch) | |
tree | 0f17deb50d1cbfd45060c1da59d864ac143bdbfd /fs/debugfs/Makefile | |
parent | 52addcf9d6669fa439387610bc65c92fa0980cef (diff) |
thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
It turns out that some boards can have instance->lower greater than 0 and
when thermal trend is dropping it results with next_target equal to -1.
Since the next_target is defined as unsigned long it is interpreted as
0xFFFFFFFF and larger than instance->upper.
As a result the next_target is set to instance->upper which ramps up to
maximal cooling device target when the temperature is steadily decreasing.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Diffstat (limited to 'fs/debugfs/Makefile')
0 files changed, 0 insertions, 0 deletions