| Age | Commit message (Collapse) | Author |
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Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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following were the errors reported
drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’:
drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default]
include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’
drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’
include/linux/thermal.h:166:29: note: declared here
make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1
make: *** [drivers/thermal/rcar_thermal.o] Error 2
with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5)
Signed-off-by: Devendra Naga <develkernel412222@gmail.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Commit 023614183768 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:
drivers/built-in.o: In function `cpufreq_get_max_state':
drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
drivers/built-in.o: In function `get_cpu_frequency':
drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'
Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.
It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.
Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
drivers/staging/omap-thermal/omap-thermal-common.
OMAP supplied dummy TC1 and TC2,
at the same time that the thermal tree removed them
from thermal_zone_device_register()
drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
propogate the upstream MAX_IDR_LEVEL re-name
to prevent a build failure
Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>
Signed-off-by: Len Brown <len.brown@intel.com>
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To avoid name conflicts:
drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined
While at it, also make the other names more consistent and add
parentheses.
[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
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This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
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devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add necessary default platform data support needed for TMU driver. The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:
* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.
2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,
a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
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Cpufreq cooling device <---------------
TODO:
*Will send the DT enablement patches later after the driver is merged.
This patch:
Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.
thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.
This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is
1. if the temperature is higher than a trip point,
a. if the trend is THERMAL_TREND_RAISING, use higher cooling
state for this trip point
b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
state for this trip point
2. if the temperature is lower than a trip point, use lower
cooling state for this trip point.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
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According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.
So We introduce .get_trend() as a more general solution.
For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
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set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.
To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.
Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.
Next patch will set these to real values.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
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Convert delayed_work users doing cancel_delayed_work() followed by
queue_delayed_work() to mod_delayed_work().
Most conversions are straight-forward. Ones worth mentioning are,
* drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always
use mod_delayed_work() and cancel loop in
edac_mc_reset_delay_period() is dropped.
* drivers/platform/x86/thinkpad_acpi.c: No need to remember whether
watchdog is active or not. @fan_watchdog_active and related code
dropped.
* drivers/power/charger-manager.c: Seemingly a lot of
delayed_work_pending() abuse going on here.
[delayed_]work_pending() are unsynchronized and racy when used like
this. I converted one instance in fullbatt_handler(). Please
conver the rest so that it invokes workqueue APIs for the intended
target state rather than trying to game work item pending state
transitions. e.g. if timer should be modified - call
mod_delayed_work(), canceled - call cancel_delayed_work[_sync]().
* drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling()
simplified. Note that round_jiffies() calls in this function are
meaningless. round_jiffies() work on absolute jiffies not delta
delay used by delayed_work.
v2: Tomi pointed out that __cancel_delayed_work() users can't be
safely converted to mod_delayed_work(). They could be calling it
from irq context and if that happens while delayed_work_timer_fn()
is running, it could deadlock. __cancel_delayed_work() users are
dropped.
Signed-off-by: Tejun Heo <tj@kernel.org>
Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Acked-by: Anton Vorontsov <cbouatmailru@gmail.com>
Acked-by: David Howells <dhowells@redhat.com>
Cc: Tomi Valkeinen <tomi.valkeinen@ti.com>
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Jiri Kosina <jkosina@suse.cz>
Cc: Doug Thompson <dougthompson@xmission.com>
Cc: David Airlie <airlied@linux.ie>
Cc: Roland Dreier <roland@kernel.org>
Cc: "John W. Linville" <linville@tuxdriver.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <len.brown@intel.com>
Cc: "J. Bruce Fields" <bfields@fieldses.org>
Cc: Johannes Berg <johannes@sipsolutions.net>
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Pull battery updates from Anton Vorontsov:
"The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
One of our patches added thermal support for power supply class, but
thermal/ subsystem changed under our feet. We (well, Stephen, that
is) caught the issue and it was decided[1] that I'd just delay the
battery pull request, and then will fix it up by merging upstream back
into battery tree at the specific commit.
That's not all though: another[2] small fixup for thermal subsystem
was needed to get rid of a warning in power supply subsystem (the
warning was not drivers/power's "fault", the thermal registration
function just needed a proper const annotation, which is also done by
a small commit on top of the merge.
So, to sum this up:
- The 'master' branch of the battery tree was in the -next tree for
weeks, was never rebased, altered etc. It should be all OK;
- Although, for-v3.6 tag contains the 'master' branch + merge + the
warning fix.
[1] http://lkml.org/lkml/2012/6/19/23
[2] http://lkml.org/lkml/2012/6/18/28"
* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
thermal: Constify 'type' argument for the registration routine
olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
olpc-battery: Add VOLTAGE_MAX_DESIGN property
charger-manager: Fix build break related to EXTCON
lp8727_charger: Move header file into platform_data directory
power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
bq27x00_battery: Add support for BQ27425 chip
charger-manager: Set current limit of regulator for over current protection
charger-manager: Use EXTCON Subsystem to detect charger cables for charging
test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
test_power: Add support for USB AC source
gpio-charger: Use cansleep version of gpio_set_value
bq27x00_battery: Add support for power average and health properties
sbs-battery: Don't trigger false supply_changed event
twl4030_charger: Allow charger to control the regulator that feeds it
twl4030_charger: Add backup-battery charging
twl4030_charger: Fix some typos
max17042_battery: Support CHARGE_COUNTER power supply attribute
smb347-charger: Add constant charge and current properties
power_supply: Add constant charge_current and charge_voltage properties
...
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thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:
CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'
Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
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'cpuidle-coupled', 'cpuidle-tweaks', 'intel_idle-ivb', 'ost', 'red-hat-bz-772730', 'thermal', 'thermal-spear' and 'turbostat-v2' into release
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The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.
This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
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Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
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SPEAr platforms now support DT and so must convert all drivers to support
DT. This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.
Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver. So, platform_data is completely removed
and passed via DT now.
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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Basically without this patch changing the mode of thermal zone
is not possible as wrong string size is passed to strncmp.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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thermal_zone_device_register() never returns NULL, on error it returns and
ERR_PTR().
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Viresh Kumar <viresh.kumar@st.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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readl/writel versions for ARM contain memory barrier instruction for
synchronizing DMA buffers. These are not required at least on this
module. So use lighter _relaxed variants.
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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ST's SPEAr13xx machines are based on CortexA9 ARM processors. These
machines contain a thermal sensor for junction temperature monitoring.
This patch adds support for this thermal sensor in existing thermal
framework.
[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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Use the current logging style.
Remove PREFIX, add pr_fmt, convert the printks. All dmesg output now
prefixed with "thermal_sys: ".
Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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Just a few tidies to make it more like most kernel sources.
A couple of long lines still remain.
Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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These don't add any value as they are used only once and the surrounding
code uses similar variable.
Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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Line continations are not necessary in function calls or statements.
Remove them.
Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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With CONFIG_NET=n:
drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used
Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET'
[akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()]
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Cc: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
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The thermal driver should use a freezable workqueue to schedule
polling to prevent thermal_zone_device_update() from being run
during system suspend, when the devices it relies on may be inactive.
Make it use the system freezable workqueue for this purpose.
Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Signed-off-by: Len Brown <len.brown@intel.com>
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THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>. Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:
* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
disabled.
* This avoids breaking the thermal kABI in these cases too, which should
make distributions happy.
The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone. But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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We'll soon need to reuse it.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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It's about time to revert 16d752397301b9 ("thermal: Create
CONFIG_THERMAL_HWMON=n"). Anybody running a kernel >= 2.6.40 would also
be running a recent enough version of lm-sensors.
Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of
dropping it, we keep it but hide it.
Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
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