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Commit 3105f234e0aba43e44e277c20f9b32ee8add43d4 replaced module
cpu id table with a cpu feature check, which is logically correct.
But we need the module device table to allow module auto loading.
Cc: stable@vger.kernel.org # 4.8
Fixes:3105f234 thermal/powerclamp: correct cpu support check
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Initial logic for checking CPU match resulted in OR of CPU features
rather than the intended AND.
Updated to use boot_cpu_has macro rather than x86_match_cpu.
In addition, MWAIT is the only required CPU feature for idle
injection to work. Drop other feature requirements since they are
only needed for optimal efficiency.
CC: stable@vger.kernel.org #v4.7
Signed-off-by: Eric Ernst <eric.ernst@linux.intel.com>
Acked-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Added missing support for Haswell PCH thermal sensor.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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On the platforms which has an ACPI companion device associated with
PCH thermal device, read passive trip temperature via ACPI _PSV
control method.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal managament updates from Zhang Rui:
- Enhance thermal "userspace" governor to export the reason when a
thermal event is triggered and delivered to user space. From Srinivas
Pandruvada
- Introduce a single TSENS thermal driver for the different versions of
the TSENS IP that exist, on different qcom msm/apq SoCs'. Support for
msm8916, msm8960, msm8974 and msm8996 families is also added. From
Rajendra Nayak
- Introduce hardware-tracked trip points support to the device tree
thermal sensor framework. The framework supports an arbitrary number
of trip points. Whenever the current temperature is changed, the trip
points immediately below and above the current temperature are found,
driver callback is invoked to program the hardware to get notified
when either of the two trip points are triggered. Hardware-tracked
trip points support for rockchip thermal driver is also added at the
same time. From Sascha Hauer, Caesar Wang
- Introduce a new thermal driver, which enables TMU (Thermal Monitor
Unit) on QorIQ platform. From Jia Hongtao
- Introduce a new thermal driver for Maxim MAX77620. From Laxman
Dewangan
- Introduce a new thermal driver for Intel platforms using WhiskeyCove
PMIC. From Bin Gao
- Add mt2701 chip support to MTK thermal driver. From Dawei Chien
- Enhance Tegra thermal driver to enable soctherm node and set
"critical", "hot" trips, for Tegra124, Tegra132, Tegra210. From Wei
Ni
- Add resume support for tango thermal driver. From Marc Gonzalez
- several small fixes and improvements for rockchip, qcom, imx, rcar,
mtk thermal drivers and thermal core code. From Caesar Wang, Keerthy,
Rocky Hao, Wei Yongjun, Peter Robinson, Bui Duc Phuc, Axel Lin, Hugh
Kang
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (48 commits)
thermal: int3403: Process trip change notification
thermal: int340x: New Interface to read trip and notify
thermal: user_space gov: Add additional information in uevent
thermal: Enhance thermal_zone_device_update for events
arm64: tegra: set hot trips for Tegra210
arm64: tegra: set critical trips for Tegra210
arm64: tegra: add soctherm node for Tegra210
arm64: tegra: set hot trips for Tegra132
arm64: tegra: set critical trips for Tegra132
arm64: tegra: use tegra132-soctherm for Tegra132
arm: tegra: set hot trips for Tegra124
arm: tegra: set critical trips for Tegra124
thermal: tegra: add hw-throttle for Tegra132
thermal: tegra: add hw-throttle function
of: Add bindings of hw throttle for Tegra soctherm
thermal: mtk_thermal: Check return value of devm_thermal_zone_of_sensor_register
thermal: Add Mediatek thermal driver for mt2701.
dt-bindings: thermal: Add binding document for Mediatek thermal controller
thermal: max77620: Add thermal driver for reporting junction temp
thermal: max77620: Add DT binding doc for thermal driver
...
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When ACPI sends notification for trip point change re-read trips and
notify thermal core, so that this can be passed to user space thermal
controller.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Separated the code for reading trip points from int340x_thermal_zone_add to
a standalone function int340x_thermal_read_trips. This standlone
interface to read is exported so that int340x drivers can re-read trips
on ACPI notification for trip point change.
Also the appropriate notification events are sent by int340x driver based
on the acpi event using int340x_thermal_zone_device_update().
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add additional properties:
NAME= Thermal zone type
TEMP= Temperature sample value
TRIP= Violated trip index
EVENT= The notification event (new temperature sample, trip violation
trip changed)
This is the additional information to what kobject_uevent already
provides. So it will not impact existing user spaces.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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'thermal-tegra-hw-throttle' into next
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Tegra132 use CCROC throttle registers to configure
pulse skiper, set these registers to enable throttle
function for Tegra132.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Tegra soctherm support HW throttle, when the soctherm snesors'
temperature is above the throttle trip point, it will trigger
pulse skiper to tune clocks accroding to the throttle depth.
Add this function for Tegra124 and Tegra210.
Since Tegra132 use different registers to configure pulse skiper,
will support it in next patch.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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devm_thermal_zone_of_sensor_register can fail, so check it's return value.
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds support for mt2701 chip to mtk_thermal,
and integrate both mt8173 and mt2701 on the same driver.
MT8173 has four banks and five sensors, and MT2701 has
only one bank and three sensors.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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When this platform is suspended, firmware powers the entire SoC down,
except a few hardware blocks waiting for wakeup events. There is no
context to save for this particular block.
Therefore, there is nothing useful for the driver to do on suspend;
so we define a NULL suspend hook. On resume, the driver initializes
the block exactly as is done in the probe callback.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Reviewed-by: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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We could see that state is defined as unsigned type, so it
should never be less than zero. Let' remove this check.
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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USE_OF_THERMAL
devm_thermal_zone_of_sensor_register() case doesn't need to call
thermal_zone_device_unregister().
Otherwise, rcar-thermal can't register thermal zone again after rebind.
This patch fixes it.
Signed-off-by: Bui Duc Phuc <bd-phuc@jinso.co.jp>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.
v2: drop extraneous OF
Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In case of error, the function of_iomap() returns NULL pointer
not ERR_PTR(). The IS_ERR() test in the return value check
should be replaced with NULL test.
And the function devm_regmap_init_mmio() returns ERR_PTR()
and never returns NULL. The NULL test in the return value
check should be replaced with IS_ERR().
Signed-off-by: Wei Yongjun <weiyj.lk@gmail.com>
Acked-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In less than 10 ms, the temperature of soc will arise 10 degree. 250 ms
is too big for soc tempeture control. Setting 2.5 ms will speed up
temperature accessing speed but introduce no more cpu's computing overhead.
We set AUTO_PERIOD_TIME and TSADCV3_AUTO_PERIOD_HT_TIME the same value,
because normal temperature update speed is also our consern in IPA.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Due to the voltage ripple, the sensing data of the tsadc is not accurate.
And in this patch, the bandgap feature is enhanced to remove the voltage
ripple, and then the tsadc can sense the temperature more precisely.
Obsolete codes are removed as well.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The newly added tsens-8916 driver produces warnings when CONFIG_PM
is disabled:
drivers/thermal/qcom/tsens.c:53:12: error: 'tsens_resume' defined but not used [-Werror=unused-function]
static int tsens_resume(struct device *dev)
^~~~~~~~~~~~
drivers/thermal/qcom/tsens.c:43:12: error: 'tsens_suspend' defined but not used [-Werror=unused-function]
static int tsens_suspend(struct device *dev)
^~~~~~~~~~~~~
This marks both functions __maybe_unused to let the compiler
know that they might be used in other configurations, without
adding ugly #ifdef logic.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.
It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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rcar-thermal is supporting both thermal_zone_of_sensor_register() and
thermal_zone_device_register(). But thermal_zone_of_sensor_register()
doesn't enable hwmon as default.
This patch enables it to keep compatibility
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Currently thermal zone set_emul_temp is set unconditionally
with of_thermal_set_emul_temp function. Set this only if the
set_emul_temp hook is provided for thermal_zone_of_device_ops.
This fixes emul_temp failures on platforms for which set_emul_temp
hook is not populated.
Fixes: "184a4bf623f (thermal: of: Extend current
of-thermal.c code to allow setting emulated temp)"
Suggested-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Conflicts:
drivers/thermal/of-thermal.c
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The hardware-tracked trips will set the alarm interrupt value for
registers. Then when the thermal zone has no trips to be set,
That make the thermal trips callback a over range value.
The root cause is the rk_tsadcv2_temp_to_code() function to handle the
invalid temperature range is indeed incorrect, let's fix it on now.
Otherwise, the thermal alarm interrupt will be triggered all the time
on some SoCs.
Fox example:
localhost tmp # grep thermal /proc/interrupts; sleep 5;
grep thermal /proc/interrupts
23: 994830 .. GICv3 129 Level rockchip_thermal
23: 1003423 .. GICv3 129 Level rockchip_thermal
Reported-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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We should increase the period cycles to save power since the rk3399 has
the high frequency for tsadc clock.
Fixes commit b0d70338bca22cb14
("thermal: rockchip: Support the RK3399 SoCs in thermal driver")
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Whenever the current temperature is updated, the trip points immediately
below and above the current temperature are found. A sensor driver
callback `set_trips' is then called with the temperatures.
Lastly, The sensor will trigger the hardware high temperature interrupts
to increase the sampleing rate and throttle frequency to limit the
temperature rising When performing passive cooling.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Tested-by: Stephen Barber <smbarber@chromium.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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With interrupt driven thermal zones we pass the lower and upper
temperature on which shall be acted, so in the governor we have to act on
the exact lower temperature to be consistent. Otherwise an interrupt maybe
generated on the exact lower temperature, but the bang bang governor does
not react since The polling driven zones have to be one step cooler before
the governor reacts.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch implements .set_trips for device tree thermal zones.
As the hardware-tracked trip points is supported by thermal core patch[0].
patch[0]
"thermal: Add support for hardware-tracked trip points".
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.
The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.
If .set_trips is not implemented, the framework behaves as before.
This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Trivial: remove the following:
drivers/thermal/qcom/tsens-8916.c:103:24: warning: symbol 'ops_8916' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8996.c:76:24: warning: symbol 'ops_8996' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8974.c:235:24: warning: symbol 'ops_8974' was not declared. Should it be static?
drivers/thermal/qcom/tsens-8960.c:279:24: warning: symbol 'ops_8960' was not declared. Should it be static?
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Rajendra Nayak <rnayak@codeaurora.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The TSENS controller in 8996 family of SoCs is capable of converting the
ADC code outputs to real temperature values (in decidegree Celsius).
It can also be programmed to provide raw ADC code, but the secure software
on 8996 programs it to provide real temperatures and also does the needed
calibrations.
We check the valid bit to ensure valid data is read by the AHB master.
And the spec recommends the below algorithm to read data 3 consecutive
times, which takes care of the worst case delay taken to propagate the
updated data to the register.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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8960 family of SoCs have the TSENS device as part of GCC, hence
the driver probes the virtual child device created by GCC and
uses the parent to extract all DT properties and reuses the GCC
regmap.
Also GCC/TSENS are part of a domain thats not always ON.
Hence add .suspend and .resume hooks to save and restore some of
the inited register context.
Also 8960 family have some of the TSENS init sequence thats
required to be done by the HLOS driver (some later versions of TSENS
do not export these registers to non-secure world, and hence need
these initializations to be done by secure bootloaders)
8660 from the same family has just one sensor and hence some register
offset/layout differences which need special handling in the driver.
Based on the original code from Siddartha Mohanadoss, Stephen Boyd and
Narendran Rajan.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add apis for platform thermal drivers to query for slope and offset
attributes, which might be needed for temperature calculations.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add .calibrate support for 8974 family as part of tsens_ops.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add support to calibrate sensors on 8916 family and also add common
functions to read temperature from sensors (This can be reused on
other SoCs having similar TSENS device)
The calibration data is read from eeprom using the generic nvmem
framework apis.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The last_load is updated not cpufreq_get_actual_power() function call
but cpufreq_get_requested_power() function call.
Signed-off-by: Inhyuk Kang <hugh.kang@lge.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Javi Merino <javi.merino@arm.com>
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In case thermal_zone_xxx_register() returns an error, priv->zone
isn't NULL any more, but contains the error code.
This is passed to thermal_zone_device_unregister(), then. This checks
for priv->zone being NULL, but the error code is != NULL. So it works
with the error code as a pointer. Crashing immediately.
To fix this, reset priv->zone to NULL before entering
rcar_gen3_thermal_remove().
Signed-off-by: Dirk Behme <dirk.behme@de.bosch.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.
Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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of_match_device could return NULL, and so cause a NULL pointer
dereference later at line 472:
data->socdata = of_id->data;
For fixing this problem, we use of_device_get_match_data(), this will
simplify the code a little by using a standard function for
getting the match data.
Reported-by: coverity (CID 1324128)
Signed-off-by: LABBE Corentin <clabbe.montjoie@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The field "owner" is set by core. Thus delete an extra initialisation.
Generated by: scripts/coccinelle/api/platform_no_drv_owner.cocci
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Currently all CPU cooling devices share a
`struct thermal_cooling_device_ops` instance. The thermal core uses the
presence of functions in this struct to determine if a cooling device
has a power model (see cdev_is_power_actor). cpu_cooling.c adds the
power model functions to the shared struct when a device is registered
with a power model.
Therefore, if a CPU cooling device is registered using
[of_]cpufreq_power_cooling_register, _all_ devices will be determined to
have a power model, including any registered with
[of_]cpufreq_cooling_register. This can result in cpufreq_state2power
being called on a device where dyn_power_table is NULL.
With this commit, instead of having a shared thermal_cooling_device_ops
which is mutated, we have two versions: one with the power functions and
one without.
Signed-off-by: Brendan Jackman <brendan.jackman@arm.com>
Cc: Amit Daniel Kachhap <amit.kachhap@gmail.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Javi Merino <javi.merino@arm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The driver allocates the mutex but not initialize it.
Use mutex_init() on it to initialize it correctly.
This is detected by Coccinelle semantic patch.
Signed-off-by: Wei Yongjun <weiyj.lk@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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thermal_add_hwmon_sysfs()/thermal_remove_hwmon_sysfs() need
EXPORT_SYMBOL_GPL(). Otherwise we will have ERROR
>> ERROR: "thermal_remove_hwmon_sysfs" [drivers/thermal/rcar_thermal.ko] undefined!
>> ERROR: "thermal_add_hwmon_sysfs" [drivers/thermal/rcar_thermal.ko] undefined!
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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