Age | Commit message (Collapse) | Author |
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* pm-em:
OPP: refactor dev_pm_opp_of_register_em() and update related drivers
Documentation: power: update Energy Model description
PM / EM: change name of em_pd_energy to em_cpu_energy
PM / EM: remove em_register_perf_domain
PM / EM: add support for other devices than CPUs in Energy Model
PM / EM: update callback structure and add device pointer
PM / EM: introduce em_dev_register_perf_domain function
PM / EM: change naming convention from 'capacity' to 'performance'
* pm-core:
mmc: jz4740: Use pm_ptr() macro
PM: Make *_DEV_PM_OPS macros use __maybe_unused
PM: core: introduce pm_ptr() macro
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git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux into master
Pull thermal fixes from Daniel Lezcano:
- Fix invalid index array access on int340x_thermal leading to a kernel
panic (Bartosz Szczepanek)
- Fix debug message level to prevent flooding on some platform (Alex
Hung)
- Fix invalid bank access by reverting "thermal: mediatek: fix register
index error" (Enric Balletbo i Serra)
* tag 'thermal-v5.8-rc6' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
Revert "thermal: mediatek: fix register index error"
thermal: int3403_thermal: Downgrade error message
thermal/int340x_thermal: Prevent page fault on .set_mode() op
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This reverts commit eb9aecd90d1a39601e91cd08b90d5fee51d321a6
The above patch is supposed to fix a register index error on mt2701. It
is not clear if the problem solved is a hang or just an invalid value
returned, my guess is the second. The patch introduces, though, a new
hang on MT8173 device making them unusable. So, seems reasonable, revert
the patch because introduces a worst issue.
The reason I send a revert instead of trying to fix the issue for MT8173
is because the information needed to fix the issue is in the datasheet
and is not public. So I am not really able to fix it.
Fixes the following bug when CONFIG_MTK_THERMAL is set on MT8173
devices.
[ 2.222488] Unable to handle kernel paging request at virtual address ffff8000125f5001
[ 2.230421] Mem abort info:
[ 2.233207] ESR = 0x96000021
[ 2.236261] EC = 0x25: DABT (current EL), IL = 32 bits
[ 2.241571] SET = 0, FnV = 0
[ 2.244623] EA = 0, S1PTW = 0
[ 2.247762] Data abort info:
[ 2.250640] ISV = 0, ISS = 0x00000021
[ 2.254473] CM = 0, WnR = 0
[ 2.257544] swapper pgtable: 4k pages, 48-bit VAs, pgdp=0000000041850000
[ 2.264251] [ffff8000125f5001] pgd=000000013ffff003, pud=000000013fffe003, pmd=000000013fff9003, pte=006800001100b707
[ 2.274867] Internal error: Oops: 96000021 [#1] PREEMPT SMP
[ 2.280432] Modules linked in:
[ 2.283483] CPU: 0 PID: 1 Comm: swapper/0 Not tainted 5.7.0-rc6+ #162
[ 2.289914] Hardware name: Google Elm (DT)
[ 2.294003] pstate: 20000005 (nzCv daif -PAN -UAO)
[ 2.298792] pc : mtk_read_temp+0xb8/0x1c8
[ 2.302793] lr : mtk_read_temp+0x7c/0x1c8
[ 2.306794] sp : ffff80001003b930
[ 2.310100] x29: ffff80001003b930 x28: 0000000000000000
[ 2.315404] x27: 0000000000000002 x26: ffff0000f9550b10
[ 2.320709] x25: ffff0000f9550a80 x24: 0000000000000090
[ 2.326014] x23: ffff80001003ba24 x22: 00000000610344c0
[ 2.331318] x21: 0000000000002710 x20: 00000000000001f4
[ 2.336622] x19: 0000000000030d40 x18: ffff800011742ec0
[ 2.341926] x17: 0000000000000001 x16: 0000000000000001
[ 2.347230] x15: ffffffffffffffff x14: ffffff0000000000
[ 2.352535] x13: ffffffffffffffff x12: 0000000000000028
[ 2.357839] x11: 0000000000000003 x10: ffff800011295ec8
[ 2.363143] x9 : 000000000000291b x8 : 0000000000000002
[ 2.368447] x7 : 00000000000000a8 x6 : 0000000000000004
[ 2.373751] x5 : 0000000000000000 x4 : ffff800011295cb0
[ 2.379055] x3 : 0000000000000002 x2 : ffff8000125f5001
[ 2.384359] x1 : 0000000000000001 x0 : ffff0000f9550a80
[ 2.389665] Call trace:
[ 2.392105] mtk_read_temp+0xb8/0x1c8
[ 2.395760] of_thermal_get_temp+0x2c/0x40
[ 2.399849] thermal_zone_get_temp+0x78/0x160
[ 2.404198] thermal_zone_device_update.part.0+0x3c/0x1f8
[ 2.409589] thermal_zone_device_update+0x34/0x48
[ 2.414286] of_thermal_set_mode+0x58/0x88
[ 2.418375] thermal_zone_of_sensor_register+0x1a8/0x1d8
[ 2.423679] devm_thermal_zone_of_sensor_register+0x64/0xb0
[ 2.429242] mtk_thermal_probe+0x690/0x7d0
[ 2.433333] platform_drv_probe+0x5c/0xb0
[ 2.437335] really_probe+0xe4/0x448
[ 2.440901] driver_probe_device+0xe8/0x140
[ 2.445077] device_driver_attach+0x7c/0x88
[ 2.449252] __driver_attach+0xac/0x178
[ 2.453082] bus_for_each_dev+0x78/0xc8
[ 2.456909] driver_attach+0x2c/0x38
[ 2.460476] bus_add_driver+0x14c/0x230
[ 2.464304] driver_register+0x6c/0x128
[ 2.468131] __platform_driver_register+0x50/0x60
[ 2.472831] mtk_thermal_driver_init+0x24/0x30
[ 2.477268] do_one_initcall+0x50/0x298
[ 2.481098] kernel_init_freeable+0x1ec/0x264
[ 2.485450] kernel_init+0x1c/0x110
[ 2.488931] ret_from_fork+0x10/0x1c
[ 2.492502] Code: f9401081 f9400402 b8a67821 8b010042 (b9400042)
[ 2.498599] ---[ end trace e43e3105ed27dc99 ]---
[ 2.503367] Kernel panic - not syncing: Attempted to kill init! exitcode=0x0000000b
[ 2.511020] SMP: stopping secondary CPUs
[ 2.514941] Kernel Offset: disabled
[ 2.518421] CPU features: 0x090002,25006005
[ 2.522595] Memory Limit: none
[ 2.525644] ---[ end Kernel panic - not syncing: Attempted to kill init! exitcode=0x0000000b ]--
Cc: Michael Kao <michael.kao@mediatek.com>
Fixes: eb9aecd90d1a ("thermal: mediatek: fix register index error")
Signed-off-by: Enric Balletbo i Serra <enric.balletbo@collabora.com>
Reviewed-by: Matthias Brugger <matthias.bgg@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200707103412.1010823-1-enric.balletbo@collabora.com
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Downgrade "Unsupported event" message from dev_err to dev_dbg to avoid
flooding with this message on some platforms.
Cc: stable@vger.kernel.org # v5.4+
Suggested-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Alex Hung <alex.hung@canonical.com>
[ rzhang: fix typo in changelog ]
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200615223957.183153-1-alex.hung@canonical.com
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Starting from commit "thermal/int340x_thermal: Don't require IDSP to
exist", priv->current_uuid_index is initialized to -1. This value may
be passed to int3400_thermal_run_osc() from int3400_thermal_set_mode,
contributing to page fault when accessing int3400_thermal_uuids array
at index -1.
This commit adds a check on uuid value to int3400_thermal_run_osc.
Fixes: 8d485da0ddee ("thermal/int340x_thermal: Don't require IDSP to exist")
Signed-off-by: Bartosz Szczepanek <bsz@semihalf.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
[ rzhang: Add Fixes tag ]
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200708134613.131555-1-bsz@semihalf.com
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As description for DIV_ROUND_CLOSEST in file include/linux/kernel.h.
"Result is undefined for negative divisors if the dividend variable
type is unsigned and for negative dividends if the divisor variable
type is unsigned."
In current code, the FIXPT_DIV uses DIV_ROUND_CLOSEST but has not
checked sign of divisor before using. It makes undefined temperature
value in case the value is negative.
This patch fixes to satisfy DIV_ROUND_CLOSEST description
and fix bug too. Note that the variable name "reg" is not good
because it should be the same type as rcar_gen3_thermal_read().
However, it's better to rename the "reg" in a further patch as
cleanup.
Signed-off-by: Van Do <van.do.xw@renesas.com>
Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
[shimoda: minor fixes, add Fixes tag]
Fixes: 564e73d283af ("thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver")
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Tested-by: Niklas Soderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1593085099-2057-1-git-send-email-yoshihiro.shimoda.uh@renesas.com
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The function cpu_power_to_freq is used to find a frequency and set the
cooling device to consume at most the power to be converted. For example,
if the power to be converted is 80mW, and the em table is as follow.
struct em_cap_state table[] = {
/* KHz mW */
{ 1008000, 36, 0 },
{ 1200000, 49, 0 },
{ 1296000, 59, 0 },
{ 1416000, 72, 0 },
{ 1512000, 86, 0 },
};
The target frequency should be 1416000KHz, not 1512000KHz.
Fixes: 349d39dc5739 ("thermal: cpu_cooling: merge frequency and power tables")
Cc: <stable@vger.kernel.org> # v4.13+
Signed-off-by: Finley Xiao <finley.xiao@rock-chips.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200619090825.32747-1-finley.xiao@rock-chips.com
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After merging tsens-common.c into tsens.c, we can now mark some
functions static so they don't need any prototype declarations. This
fixes the following issue reported by lkp.
>> drivers/thermal/qcom/tsens.c:385:13: warning: no previous prototype for 'tsens_critical_irq_thread' [-Wmissing-prototypes]
385 | irqreturn_t tsens_critical_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:455:13: warning: no previous prototype for 'tsens_irq_thread' [-Wmissing-prototypes]
455 | irqreturn_t tsens_irq_thread(int irq, void *data)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:523:5: warning: no previous prototype for 'tsens_set_trips' [-Wmissing-prototypes]
523 | int tsens_set_trips(void *_sensor, int low, int high)
| ^~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:560:5: warning: no previous prototype for 'tsens_enable_irq' [-Wmissing-prototypes]
560 | int tsens_enable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~
>> drivers/thermal/qcom/tsens.c:573:6: warning: no previous prototype for 'tsens_disable_irq' [-Wmissing-prototypes]
573 | void tsens_disable_irq(struct tsens_priv *priv)
| ^~~~~~~~~~~~~~~~~
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reported-by: kbuild test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/6757a26876b29922929abf64b1c11fa3b3033d03.1590579709.git.amit.kucheria@linaro.org
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When call function devm_platform_ioremap_resource(), we should use IS_ERR()
to check the return value and return PTR_ERR() if failed.
Fixes: 554fdbaf19b1 ("thermal: sprd: Add Spreadtrum thermal driver support")
Signed-off-by: Tiezhu Yang <yangtiezhu@loongson.cn>
Reviewed-by: Baolin Wang <baolin.wang7@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1590371941-25430-1-git-send-email-yangtiezhu@loongson.cn
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MT8183_NUM_ZONES should be set to 1
because MT8183 doesn't have multiple banks.
Fixes: a4ffe6b52d27 ("thermal: mediatek: add support for MT8183")
Signed-off-by: Michael Kao <michael.kao@mediatek.com>
Signed-off-by: Hsin-Yi Wang <hsinyi@chromium.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200323121537.22697-6-michael.kao@mediatek.com
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After finishing using cpu node got from of_get_cpu_node(), of_node_put()
needs to be called.
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1585232945-23368-1-git-send-email-Anson.Huang@nxp.com
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The Energy Model uses concept of performance domain and capacity states in
order to calculate power used by CPUs. Change naming convention from
capacity to performance state would enable wider usage in future, e.g.
upcoming support for other devices other than CPUs.
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Quentin Perret <qperret@google.com>
Signed-off-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
private structures) (Daniel Lezcano)
- Use the PM QoS frequency changes for the devfreq cooling device
(Matthias Kaehlcke)
- Remove duplicate error messages from platform_get_irq() error
handling (Markus Elfring)
- Add support for the bandgap sensors (Keerthy)
- Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
- Add Renesas R-Car maintainer entry (Niklas Söderlund)
- Fix error checking after calling ti_bandgap_get_sensor_data() for the
TI SoC thermal (Sudip Mukherjee)
- Add latency constraint for the idle injection, the DT binding and the
change the registering function (Daniel Lezcano)
- Convert the thermal framework binding to the Yaml schema (Amit
Kucheria)
- Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
R. Silva)
- Thermal framework cleanups (alphabetic order for heads, replace
module.h by export.h, make file naming consistent) (Amit Kucheria)
- Merge tsens-common into the tsens driver (Amit Kucheria)
- Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
- Clean up the rcar_thermal_update_temp() function in the rcar thermal
driver (Niklas Söderlund)
- Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
Tang)
- Export GDDV, OEM vendor variables, and don't require IDSP for the
int340x thermal driver - trivial conflicts fixed (Matthew Garrett)
* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
thermal/int340x_thermal: Don't require IDSP to exist
thermal/int340x_thermal: Export OEM vendor variables
thermal/int340x_thermal: Export GDDV
thermal: qoriq: Update the settings for TMUv2
thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
thermal: qoriq: Add platform dependencies
drivers: thermal: tsens: Merge tsens-common.c into tsens.c
thermal/of: Rename of-thermal.c
thermal/governors: Prefix all source files with gov_
thermal/drivers/user_space: Sort headers alphabetically
thermal/drivers/of-thermal: Sort headers alphabetically
thermal/drivers/cpufreq_cooling: Replace module.h with export.h
thermal/drivers/cpufreq_cooling: Sort headers alphabetically
thermal/drivers/clock_cooling: Include export.h
thermal/drivers/clock_cooling: Sort headers alphabetically
thermal/drivers/thermal_hwmon: Include export.h
thermal/drivers/thermal_hwmon: Sort headers alphabetically
thermal/drivers/thermal_helpers: Include export.h
thermal/drivers/thermal_helpers: Sort headers alphabetically
thermal/core: Replace module.h with export.h
...
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The IDSP method doesn't appear to exist on the most recent Intel platforms:
instead, the IDSP data is included in the GDDV blob. Since we probably
don't want to decompress and parse that in-kernel, just allow any UUID to
be written if IDSP is missing.
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
[ rzhang: fix checkpatch warning in changelog ]
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-3-matthewgarrett@google.com
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The platform vendor may expose an array of OEM-specific values to be used
in determining DPTF policy. These are obtained via the ODVP method, and
then simply exposed in sysfs. In addition, they are updated when a
notification is received or when the DPTF policy is changed by userland.
Conflicts:
drivers/thermal/intel/int340x_thermal/int3400_thermal.c
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-2-matthewgarrett@google.com
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Implementing DPTF properly requires making use of firmware-provided
information associated with the INT3400 device. Calling GDDV provides a
buffer of information which userland can then interpret to determine
appropriate DPTF policy.
Conflicts:
drivers/thermal/intel/int340x_thermal/int3400_thermal.c
Signed-off-by: Matthew Garrett <mjg59@google.com>
Tested-by: Pandruvada, Srinivas <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200414020953.255364-1-matthewgarrett@google.com
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For TMU v2, TMSAR registers need to be set properly to get the
accurate temperature values.
Also the temperature read needs to be converted to degree Celsius
since it is in degrees Kelvin.
Signed-off-by: Yuantian Tang <andy.tang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200526060212.4118-1-andy.tang@nxp.com
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Moving the ctemp variable out of the private data structure made it
possible to clean up rcar_thermal_update_temp(). Initialize the local
ctemp to the error code to return if the reading fails and just return
it at the end of the function.
It's OK to change the datatype of old, new and ctemp to int as all
values are ANDed with CTEMP (0x3f) before being stored. While at it
change the datatype of the loop variable 'i' to to unsigned int.
Suggested-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200514152505.1927634-1-niklas.soderlund+renesas@ragnatech.se
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The QorIQ Thermal Monitoring Unit is only present on Freescale E500MC
and Layerscape SoCs, and on NXP i.MX8 SoCs. Add platform dependencies
to the QORIQ_THERMAL config symbol, to avoid asking the user about it
when configuring a kernel without support for any of the aforementioned
SoCs.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Li Yang <leoyang.li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507112955.23520-5-geert+renesas@glider.be
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tsens-common.c has outlived its usefuless. It was created expecting lots
of custom routines per version of the TSENS IP. We haven't needed those,
there is now only data in the version-specific files.
Merge the code for tsens-common.c into tsens.c. As a result,
- Remove any unnecessary forward declarations in tsens.h.
- Add a Linaro copyright to tsens.c.
- Fixup the Makefile to remove tsens-common.c.
- Where it made sense, fix some 80-column alignments in the
tsens-common.c code being copied over.
There is no functional change with this patch.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/e30e2ba6fa5c007983afd4d7d4e0311c0b57917a.1588183879.git.amit.kucheria@linaro.org
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Core thermal framework code files should start with thermal_*.
of-thermal.c does not follow this pattern and can easily be confused
with platform driver.
Fix this by renaming it to thermal_of.c
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f5e233d5c5dcc7c7cb56b3448da255cb2c9ef0d1.1589199124.git.amit.kucheria@linaro.org
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Bang-bang governor source file is prefixed with gov_. Do the same for
other governors for consistency so they're easy to find in the sources.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b9a85d3204712f14e320504948c12712dc0b291b.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/406d0c7c961e997b42e25adf4e432fe4f57b315a.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f9f9d8117f1659872114ba65bbfa9ed4b813128f.1589199124.git.amit.kucheria@linaro.org
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cpufreq_cooling cannot be modular, remove the unnecessary module.h
include and replace with export.h to handle EXPORT_SYMBOL family of
macros.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/7a439e41e91d8bc5ff99207f99723fcf04ca36eb.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/4231f5dfe758b9bf716981be71cadf9642c83528.1589199124.git.amit.kucheria@linaro.org
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It is preferrable to include export.h when you are using EXPORT_SYMBOL
family of macros.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/25f16415ab7b7587a052f1bce4133da318d58192.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f8e1258fd8b882bab018de63c7e713b4334fec30.1589199124.git.amit.kucheria@linaro.org
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It is preferable to include export.h when you are using EXPORT_SYMBOL
family of macros.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/f542962494a8441fdc8e550a11d0e535b92362a0.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/29b64f1fe81e674c753c8f8309c310acd782ebea.1589199124.git.amit.kucheria@linaro.org
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It is preferable to include export.h when you are using EXPORT_SYMBOL
family of macros.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/fd3443f00dbba6ca90f35726c7451ae52145d2d4.1589199124.git.amit.kucheria@linaro.org
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Sort headers to make it easier to read and find duplicate headers.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/133db154796f354e6c51e6310095f679e1f45441.1589199124.git.amit.kucheria@linaro.org
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Thermal core cannot be modular, remove the unnecessary module.h include
and replace with export.h to handle EXPORT_SYMBOL family of macros.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/33af23406dcdb0c62dae1e6401446b997ccb449f.1589199124.git.amit.kucheria@linaro.org
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The thermal framework can no longer be compiled as a module as of
commit 554b3529fe01 ("thermal/drivers/core: Remove the module Kconfig's
option"). Remove the MODULE_* tags.
Rui is mentioned in the copyright line at the top of the file and the
license is mentioned in the SPDX tags. So no loss of information.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/74339a09a55f8f3d86c4074fc2bf853a302d6186.1589199124.git.amit.kucheria@linaro.org
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The current codebase makes use of the zero-length array language
extension to the C90 standard, but the preferred mechanism to declare
variable-length types such as these ones is a flexible array member[1][2],
introduced in C99:
struct foo {
int stuff;
struct boo array[];
};
By making use of the mechanism above, we will get a compiler warning
in case the flexible array does not occur last in the structure, which
will help us prevent some kind of undefined behavior bugs from being
inadvertently introduced[3] to the codebase from now on.
Also, notice that, dynamic memory allocations won't be affected by
this change:
"Flexible array members have incomplete type, and so the sizeof operator
may not be applied. As a quirk of the original implementation of
zero-length arrays, sizeof evaluates to zero."[1]
sizeof(flexible-array-member) triggers a warning because flexible array
members have incomplete type[1]. There are some instances of code in
which the sizeof operator is being incorrectly/erroneously applied to
zero-length arrays and the result is zero. Such instances may be hiding
some bugs. So, this work (flexible-array member conversions) will also
help to get completely rid of those sorts of issues.
This issue was found with the help of Coccinelle.
[1] https://gcc.gnu.org/onlinedocs/gcc/Zero-Length.html
[2] https://github.com/KSPP/linux/issues/21
[3] commit 76497732932f ("cxgb3/l2t: Fix undefined behaviour")
Signed-off-by: Gustavo A. R. Silva <gustavoars@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200507192517.GA16557@embeddedor
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Today, there is no user for the cpuidle cooling device. The targetted
platform is ARM and ARM64.
The cpuidle and the cpufreq cooling device are based on the device tree.
As the cpuidle cooling device can have its own configuration depending
on the platform and the available idle states. The DT node description
will give the optional properties to set the cooling device up.
Do no longer rely on the CPU node which is prone to error and will
lead to a confusion in the DT because the cpufreq cooling device is
also using it. Let initialize the cpuidle cooling device with the DT
binding.
This was tested on:
- hikey960
- hikey6220
- rock960
- db845c
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Tested-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
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i.MX8 SoCs DTS file needs system control macro definitions, so move them
into dt-binding headfile, then include/linux/firmware/imx/types.h can be
removed and those drivers using it should be changed accordingly.
Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
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On error the function ti_bandgap_get_sensor_data() returns the error
code in ERR_PTR() but we only checked if the return value is NULL or
not. And, so we can dereference an error code inside ERR_PTR.
While at it, convert a check to IS_ERR_OR_NULL.
Signed-off-by: Sudip Mukherjee <sudipm.mukherjee@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200424161944.6044-1-sudipm.mukherjee@gmail.com
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int3400_thermal_ops is used inside int3400_thermal_probe() only after
the assignments, which can just as well be made statically at struct's
initizer.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200414180105.20042-2-andrzej.p@collabora.com
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Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 AM654 supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200407055116.16082-3-j-keerthy@ti.com
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The function “platform_get_irq” can log an error already.
Thus omit redundant messages for the exception handling in the
calling functions.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/05f49ae7-5cc7-d6a0-fc3d-abaf2a0b373c@web.de
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The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
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The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
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The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.
Move the structure to the thermal_core.h internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org
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The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
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The structure belongs to the thermal core internals but it is exported
in the include/linux/thermal.h
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the structure in the thermal core internal
header file.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org
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The default governor set at compilation time is a thermal internal
business, no need to export to the global thermal header.
Move the config options to the internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
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Now that devfreq supports limiting the frequency range of a device
through PM QoS make use of it instead of disabling OPPs that should
not be used.
The switch from disabling OPPs to PM QoS introduces a subtle behavioral
change in case of conflicting requests (min > max): PM QoS gives
precedence to the MIN_FREQUENCY request, while higher OPPs disabled
with dev_pm_opp_disable() would override MIN_FREQUENCY.
Signed-off-by: Matthias Kaehlcke <mka@chromium.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200318114548.19916-4-lukasz.luba@arm.com
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The last temperature and the current temperature are show via a
dev_debug. The line before, those temperature are also traced.
It is pointless to duplicate the traces for the temperatures,
remove the dev_dbg traces.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200331165449.30355-2-daniel.lezcano@linaro.org
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The function thermal_zone_set_trips() is used by the thermal core code
in order to update the next trip points, there are no other users.
Move the function definition in the thermal_core.h, remove the
EXPORT_SYMBOL_GPL and document the function.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Link: https://lore.kernel.org/r/20200331165449.30355-1-daniel.lezcano@linaro.org
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