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path: root/drivers/thermal/ti-soc-thermal/ti-thermal-common.c
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2017-10-31thermal: ti-soc-thermal: Fix ti_thermal_unregister_cpu_cooling NULL pointer ↵Tony Lindgren
on unload While debugging some PM issues and trying to remove all the loaded modules, I ran across the following when unloading ti-soc-thermal: Unable to handle kernel NULL pointer dereference at virtual address 000000b4 ... [<c08db340>] (kobject_put) from [<bf28954c>] (ti_thermal_unregister_cpu_cooling+0x20/0x28 [ti_soc_thermal]) [<bf28954c>] (ti_thermal_unregister_cpu_cooling [ti_soc_thermal]) from [<bf287c88>] (ti_bandgap_remove+0x3c/0x104 [ti_soc_thermal]) [<bf287c88>] (ti_bandgap_remove [ti_soc_thermal]) from [<c0610d48>] (platform_drv_remove+0x24/0x3c) [<c0610d48>] (platform_drv_remove) from [<c060f114>] (device_release_driver_internal+0x160/0x208) [<c060f114>] (device_release_driver_internal) from [<c060f200>] (driver_detach+0x38/0x6c) [<c060f200>] (driver_detach) from [<c060e2d4>] (bus_remove_driver+0x4c/0xa0) [<c060e2d4>] (bus_remove_driver) from [<c01f2370>] (SyS_delete_module+0x168/0x238) [<c01f2370>] (SyS_delete_module) from [<c0108240>] (ret_fast_syscall+0x0/0x28) Cc: Keerthy <j-keerthy@ti.com> Signed-off-by: Tony Lindgren <tony@atomide.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-05-27thermal: cpu_cooling: use cpufreq_policy to register cooling deviceViresh Kumar
The CPU cooling driver uses the cpufreq policy, to get clip_cpus, the frequency table, etc. Most of the callers of CPU cooling driver's registration routines have the cpufreq policy with them, but they only pass the policy->related_cpus cpumask. The __cpufreq_cooling_register() routine then gets the policy by itself and uses it. It would be much better if the callers can pass the policy instead directly. This also fixes a basic design flaw, where the policy can be freed while the CPU cooling driver is still active. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29thermal: ti-soc-thermal: Remove redundant codeKeerthy
ti_thermal_expose_sensor always takes the devm_thermal_zone_of_sensor_register call for registration with the device tree nodes present for all the bandgap sensors for omap3/4/5 and dra7 family. There are large chunks of unused code. Removing all of them. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-03-29thermal: ti-soc-thermal: Fetch slope and offset from DTKeerthy
Currently slope and offset values for calculating the hot spot temperature of a thermal zone is being taken directly from driver data. So fetch them from device tree. Signed-off-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-09-27thermal: Enhance thermal_zone_device_update for eventsSrinivas Pandruvada
Added one additional parameter to thermal_zone_device_update() to provide caller with an optional capability to specify reason. Currently this event is used by user space governor to trigger different processing based on event code. Also it saves an additional call to read temperature when the event is received. The following events are cuurently defined: - Unspecified event - New temperature sample - Trip point violated - Trip point changed - thermal device up and down - thermal device power capability changed Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27thermal: streamline get_trend callbacksSascha Hauer
The .get_trend callback in struct thermal_zone_device_ops has the prototype: int (*get_trend) (struct thermal_zone_device *, int, enum thermal_trend *); whereas the .get_trend callback in struct thermal_zone_of_device_ops has: int (*get_trend)(void *, long *); Streamline both prototypes and add the trip argument to the OF callback aswell and use enum thermal_trend * instead of an integer pointer. While the OF prototype may be the better one, this should be decided at framework level and not on OF level. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Signed-off-by: Caesar Wang <wxt@rock-chips.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Reviewed-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-05-17thermal: convert ti-thermal to use devm_thermal_zone_of_sensor_registerEduardo Valentin
This changes the driver to use the devm_ version of thermal_zone_of_sensor_register and cleans up the local points and unregister calls. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-omap@vger.kernel.org Cc: linux-kernel@vger.kernel.org Tested-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-08-03thermal: consistently use int for temperaturesSascha Hauer
The thermal code uses int, long and unsigned long for temperatures in different places. Using an unsigned type limits the thermal framework to positive temperatures without need. Also several drivers currently will report temperatures near UINT_MAX for temperatures below 0°C. This will probably immediately shut the machine down due to overtemperature if started below 0°C. 'long' is 64bit on several architectures. This is not needed since INT_MAX °mC is above the melting point of all known materials. Consistently use a plain 'int' for temperatures throughout the thermal code and the drivers. This only changes the places in the drivers where the temperature is passed around as pointer, when drivers internally use another type this is not changed. Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de> Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Jean Delvare <jdelvare@suse.de> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Reviewed-by: Darren Hart <dvhart@linux.intel.com> Reviewed-by: Heiko Stuebner <heiko@sntech.de> Reviewed-by: Peter Feuerer <peter@piie.net> Cc: Punit Agrawal <punit.agrawal@arm.com> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: Jean Delvare <jdelvare@suse.de> Cc: Peter Feuerer <peter@piie.net> Cc: Heiko Stuebner <heiko@sntech.de> Cc: Lukasz Majewski <l.majewski@samsung.com> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: linux-acpi@vger.kernel.org Cc: platform-driver-x86@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-omap@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Guenter Roeck <linux@roeck-us.net> Cc: Rafael J. Wysocki <rjw@rjwysocki.net> Cc: Maxime Ripard <maxime.ripard@free-electrons.com> Cc: Darren Hart <dvhart@infradead.org> Cc: lm-sensors@lm-sensors.org Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-04cleanup ti-soc-thermalPavel Machek
Simplify code by removing goto's where they point to simple return. Avoid confusing |= on error values. Correct whitespace. Signed-off-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: of: fix cooling device weights in device treeKapileshwar Singh
Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-24ti-soc-thermal: Delete an unnecessary check before the function call ↵Markus Elfring
"cpufreq_cooling_unregister" The cpufreq_cooling_unregister() function tests whether its argument is NULL and then returns immediately. Thus the test around the call is not needed. This issue was detected by using the Coccinelle software. Signed-off-by: Markus Elfring <elfring@users.sourceforge.net> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-21Merge branch 'fixes' of ↵Zhang Rui
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
2014-12-12thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER caseEduardo Valentin
Avoid printing the error message in the EPROBE_DEFER case where registering cpu cooling at ti-soc-thermal thermal driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: cpu_cooling: check for the readiness of cpufreq layerEduardo Valentin
In this patch, the cpu_cooling code checks for the usability of cpufreq layer before proceeding with the CPU cooling device registration. The main reason is: CPU cooling device is not usable if cpufreq cannot switch frequencies. Similar checks are spread in thermal drivers. Thus, the advantage now is to have the check in a single place: cpu cooling device registration. For this reason, this patch also updates the existing drivers that depend on CPU cooling to simply propagate the error code of the cpu cooling registration call. Therefore, in case cpufreq is not ready, the thermal drivers will still return -EPROBE_DEFER, in an attempt to try again when cpufreq layer gets ready. Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-samsung-soc@vger.kernel.org Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Cc: Rob Herring <robh+dt@kernel.org> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20thermal: of: improve of-thermal sensor registration APIEduardo Valentin
Different drivers request API extensions in of-thermal. For this reason, additional callbacks are required to fit the new drivers needs. The current API implementation expects the registering sensor driver to provide a get_temp and get_trend callbacks as function parameters. As the amount of callbacks is growing, this patch changes the existing implementation to use a .ops field to hold all the of thermal callbacks to sensor drivers. This patch also changes the existing of-thermal users to fit the new API design. No functional change is introduced in this patch. Cc: Alexandre Courbot <gnurou@gmail.com> Cc: devicetree@vger.kernel.org Cc: Grant Likely <grant.likely@linaro.org> Cc: Guenter Roeck <linux@roeck-us.net> Cc: Jean Delvare <jdelvare@suse.de> Cc: linux-kernel@vger.kernel.org Cc: linux-pm@vger.kernel.org Cc: linux-tegra@vger.kernel.org Cc: lm-sensors@lm-sensors.org Cc: Rob Herring <robh+dt@kernel.org> Cc: Stephen Warren <swarren@wwwdotorg.org> Cc: Thierry Reding <thierry.reding@gmail.com> Cc: Zhang Rui <rui.zhang@intel.com> Acked-by: Guenter Roeck <linux@roeck-us.net> Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi> Reviewed-by: Alexandre Courbot <acourbot@nvidia.com> Reviewed-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2013-12-04thermal: ti-soc-thermal: use thermal DT infrastructureEduardo Valentin
This patch improves the ti-soc-thermal driver by adding the support to build the thermal zones based on DT nodes. The driver will have two options now to build the thermal zones. The first option is the zones originally coded in this driver. So, the driver behavior will be same if there is no DT node describing the zones. The second option, when it is found a DT node with thermal data, will used the common infrastructure to build the thermal zone and bind its cooling devices. In case the driver loads thermal data using the legacy mode, this driver still adds to the system a cpufreq cooling device. Loading the thermal data from DT, the driver assumes someone else will add the cpufreq cooling device, like the cpufreq driver. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-10-15drivers: thermal: allow ti-soc-thermal run without pcb zoneEduardo Valentin
This patch changes the behavior of TI SoC thermal driver when there is a PCB thermal zone. Instead of reporting an error code when reading from PCB temperature sensor fails, this patch will make the driver attempt to compose the hotspot extrapolation based on bandgap readings only. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: ti-soc-thermal: Set the bandgap mask counter delay valueRanganath Krishnan
Set the bandgap mask counter_delay with the polling_delay value on registering the thermal zone. This patch will ensure to get the correct update interval for computing the thermal trend. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-13thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULLEduardo Valentin
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL() macro. This macro can lead to dangerous results, like returning success (0) during a failure scenario (NULL pointer handling). For this reason this patch is changing the driver after revisiting the code. These are the cases: i. For cases in which IS_ERR_OR_NULL() is used for checking return values of functions that returns either PTR_ERR() or a valid pointer, it has been translated to IS_ERR() check only. ii. For cases that a NULL check is still needed, it has been translated to if (!ptr || IS_ERR(ptr)). Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13thermal: ti-soc-thermal: remove external heat while extrapolating hotspotEduardo Valentin
For boards that provide a PCB sensor close to SoC junction temperature, it is possible to remove the cumulative heat reported by the SoC temperature sensor. This patch changes the extrapolation computation to consider an external sensor in the extrapolation equations. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28thermal: introduce TI SoC thermal driverEduardo Valentin
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>