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path: root/drivers/thermal/thermal_core.h
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2016-11-23thermal: core: move cooling device sysfs to thermal_sysfs.cEduardo Valentin
This is a code reorganization, simply to concentrate the sysfs handling functions in thermal_sysfs.c. This patch moves the cooling device handling functions. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: move to_cooling_device macro to header fileEduardo Valentin
Make the to_cooling_device() macro available across files in thermal core. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: move thermal_zone sysfs to thermal_sysfs.cEduardo Valentin
This is a code reorganization, simply to concentrate the code handling sysfs in a specific file: thermal_sysfs.c. Right now, moving only the sysfs entries of thermal_zone_device. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: move to_thermal_zone() macro to header fileEduardo Valentin
Simply making this macro available to other thermal core files. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: split available_policies_show()Eduardo Valentin
This patch creates a helper to build a list of available governors. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: split policy_storeEduardo Valentin
Similarly to passive_store, policy_store now is split between thermal core data structure handling and sysfs handling. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-11-23thermal: core: split passive_storeEduardo Valentin
Split passive_store between sysfs handling and thermal core internal data handling. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-12-29Thermal: initialize thermal zone device correctlyZhang Rui
After thermal zone device registered, as we have not read any temperature before, thus tz->temperature should not be 0, which actually means 0C, and thermal trend is not available. In this case, we need specially handling for the first thermal_zone_device_update(). Both thermal core framework and step_wise governor is enhanced to handle this. And since the step_wise governor is the only one that uses trends, so it's the only thermal governor that needs to be updated. CC: <stable@vger.kernel.org> #3.18+ Tested-by: Manuel Krause <manuelkrause@netscape.net> Tested-by: szegad <szegadlo@poczta.onet.pl> Tested-by: prash <prash.n.rao@gmail.com> Tested-by: amish <ammdispose-arch@yahoo.com> Tested-by: Matthias <morpheusxyz123@yahoo.de> Reviewed-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Chen Yu <yu.c.chen@intel.com>
2015-06-11Merge branch 'linus' of ↵Zhang Rui
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
2015-05-04thermal: introduce the Power Allocator governorJavi Merino
The power allocator governor is a thermal governor that controls system and device power allocation to control temperature. Conceptually, the implementation divides the sustainable power of a thermal zone among all the heat sources in that zone. This governor relies on "power actors", entities that represent heat sources. They can report current and maximum power consumption and can set a given maximum power consumption, usually via a cooling device. The governor uses a Proportional Integral Derivative (PID) controller driven by the temperature of the thermal zone. The output of the controller is a power budget that is then allocated to each power actor that can have bearing on the temperature we are trying to control. It decides how much power to give each cooling device based on the performance they are requesting. The PID controller ensures that the total power budget does not exceed the control temperature. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: export weight to sysfsJavi Merino
It's useful to have access to the weights for the cooling devices for thermal zones and change them if needed. Export them to sysfs. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Javi Merino <javi.merino@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04thermal: of: fix cooling device weights in device treeKapileshwar Singh
Currently you can specify the weight of the cooling device in the device tree but that information is not populated to the thermal_bind_params where the fair share governor expects it to be. The of thermal zone device doesn't have a thermal_bind_params structure and arguably it's better to pass the weight inside the thermal_instance as it is specific to the bind of a cooling device to a thermal zone parameter. Core thermal code is fixed to populate the weight in the instance from the thermal_bind_params, so platform code that was passing the weight inside the thermal_bind_params continue to work seamlessly. While we are at it, create a default value for the weight parameter for those thermal zones that currently don't define it and remove the hardcoded default in of-thermal. Cc: Zhang Rui <rui.zhang@intel.com> Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> Cc: Len Brown <lenb@kernel.org> Cc: Peter Feuerer <peter@piie.net> Cc: Darren Hart <dvhart@infradead.org> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Kukjin Kim <kgene@kernel.org> Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-01thermal: Use bool function return values of true/false not 1/0Joe Perches
Use the normal return values for bool functions Signed-off-by: Joe Perches <joe@perches.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-01-05thermal: of: Remove bogus type qualifier for of_thermal_get_trip_points()Geert Uytterhoeven
With gcc 4.1.2, 4.2, and 4.2.4 (4.4 and later are OK): drivers/thermal/thermal_core.h:110: warning: type qualifiers ignored on function return type Signed-off-by: Geert Uytterhoeven <geert@linux-m68k.org> Fixes: ce8be7785922de0e ("thermal: of: Extend of-thermal to export table of trip points") Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: of: Extend of-thermal to export table of trip pointsLukasz Majewski
This patch extends the of-thermal.c to export trip points for a given thermal zone. Thermal drivers should use of_thermal_get_trip_points() method to get pointer to table of thermal trip points. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: of: Extend of-thermal.c to provide check if trip point is validLukasz Majewski
This patch extends the of-thermal.c to provide check if trip point is valid. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08thermal: of: Extend of-thermal.c to provide number of trip pointsLukasz Majewski
This patch extends the of-thermal.c to provide information about number of available trip points. Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-08-27thermal: Added Bang-bang thermal governorPeter Feuerer
The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-12-04thermal: introduce device tree parserEduardo Valentin
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-04-14Thermal: build thermal governors into thermal_sys moduleZhang Rui
The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2012-11-05Thermal: Move thermal_instance to thermal_core.hDurgadoss R
This patch creates a thermal_core.h file which can contain all defines used by the core thermal framework files. For now, move the thermal_instance structure to thermal_core.h This structure is used by files under drivers/thermal/. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>