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git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core
Pull driver core and debugfs updates from Greg KH:
"Here is the "big" driver core and debugfs changes for 5.3-rc1
It's a lot of different patches, all across the tree due to some api
changes and lots of debugfs cleanups.
Other than the debugfs cleanups, in this set of changes we have:
- bus iteration function cleanups
- scripts/get_abi.pl tool to display and parse Documentation/ABI
entries in a simple way
- cleanups to Documenatation/ABI/ entries to make them parse easier
due to typos and other minor things
- default_attrs use for some ktype users
- driver model documentation file conversions to .rst
- compressed firmware file loading
- deferred probe fixes
All of these have been in linux-next for a while, with a bunch of
merge issues that Stephen has been patient with me for"
* tag 'driver-core-5.3-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/driver-core: (102 commits)
debugfs: make error message a bit more verbose
orangefs: fix build warning from debugfs cleanup patch
ubifs: fix build warning after debugfs cleanup patch
driver: core: Allow subsystems to continue deferring probe
drivers: base: cacheinfo: Ensure cpu hotplug work is done before Intel RDT
arch_topology: Remove error messages on out-of-memory conditions
lib: notifier-error-inject: no need to check return value of debugfs_create functions
swiotlb: no need to check return value of debugfs_create functions
ceph: no need to check return value of debugfs_create functions
sunrpc: no need to check return value of debugfs_create functions
ubifs: no need to check return value of debugfs_create functions
orangefs: no need to check return value of debugfs_create functions
nfsd: no need to check return value of debugfs_create functions
lib: 842: no need to check return value of debugfs_create functions
debugfs: provide pr_fmt() macro
debugfs: log errors when something goes wrong
drivers: s390/cio: Fix compilation warning about const qualifiers
drivers: Add generic helper to match by of_node
driver_find_device: Unify the match function with class_find_device()
bus_find_device: Unify the match callback with class_find_device
...
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git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip
Pull x86 topology updates from Ingo Molnar:
"Implement multi-die topology support on Intel CPUs and expose the die
topology to user-space tooling, by Len Brown, Kan Liang and Zhang Rui.
These changes should have no effect on the kernel's existing
understanding of topologies, i.e. there should be no behavioral impact
on cache, NUMA, scheduler, perf and other topologies and overall
system performance"
* 'x86-topology-for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/tip/tip:
perf/x86/intel/rapl: Cosmetic rename internal variables in response to multi-die/pkg support
perf/x86/intel/uncore: Cosmetic renames in response to multi-die/pkg support
hwmon/coretemp: Cosmetic: Rename internal variables to zones from packages
thermal/x86_pkg_temp_thermal: Cosmetic: Rename internal variables to zones from packages
perf/x86/intel/cstate: Support multi-die/package
perf/x86/intel/rapl: Support multi-die/package
perf/x86/intel/uncore: Support multi-die/package
topology: Create core_cpus and die_cpus sysfs attributes
topology: Create package_cpus sysfs attribute
hwmon/coretemp: Support multi-die/package
powercap/intel_rapl: Update RAPL domain name and debug messages
thermal/x86_pkg_temp_thermal: Support multi-die/package
powercap/intel_rapl: Support multi-die/package
powercap/intel_rapl: Simplify rapl_find_package()
x86/topology: Define topology_logical_die_id()
x86/topology: Define topology_die_id()
cpu/topology: Export die_id
x86/topology: Create topology_max_die_per_package()
x86/topology: Add CPUID.1F multi-die/package support
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When calling debugfs functions, there is no need to ever check the
return value. The function can work or not, but the code logic should
never do something different based on this.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Based on 2 normalized pattern(s):
it and or modify it under the terms of the gnu general public
license version 2 as published by the free software foundation this
program is distributed in the hope it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details you should have received a copy of the gnu general
public license along with this program
this program is free software you can redistribute it and or modify
it under the terms and conditions of the gnu general public license
version 2 as published by the free software foundation this program
is distributed in the hope it will be useful but without any
warranty without even the implied warranty of merchantability or
fitness for a particular purpose see the gnu general public license
for more details you should have received a copy of the gnu general
public license along with this program
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 11 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190530000434.249870634@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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from packages
Syntax update only -- no logical or functional change.
In response to the new multi-die/package changes, update variable names to
use the more generic thermal "zone" terminology, instead of "package", as
the zones can refer to either packages or die.
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Link: https://lkml.kernel.org/r/b65494a76be13481dc3a809c75debb2574c34eda.1557769318.git.len.brown@intel.com
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Package temperature sensors are actually implemented in hardware per-die.
Thus, the new multi-die/package systems sport mulitple package thermal
zones for each package.
Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose
multiple zones per package, instead of just one.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
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This cleans up the directory a bit, now that we have several other
platforms using platform-specific sub-directories. Compile-tested with
ARCH=x86 defconfig and the drivers explicitly enabled with menuconfig.
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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