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path: root/drivers/thermal/fair_share.c
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2014-07-29thermal: trace: Trace when temperature is above a trip pointPunit Agrawal
Create a new event to trace when the temperature is above a trip point. Use the trace-point when handling non-critical and critical trip pionts. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <edubezval@gmail.com> Cc: Steven Rostedt <rostedt@goodmis.org> Cc: Frederic Weisbecker <fweisbec@gmail.com> Cc: Ingo Molnar <mingo@redhat.com> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2013-04-14Thermal: build thermal governors into thermal_sys moduleZhang Rui
The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2012-11-05thermal: fair_share: Add missing static storage class specifiersSachin Kamat
Fixes the following sparse warnings: drivers/thermal/fair_share.c:80:5: warning: symbol 'fair_share_throttle' was not declared. Should it be static? drivers/thermal/fair_share.c:111:25: warning: symbol 'thermal_gov_fair_share' was not declared. Should it be static? Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Introduce fair_share thermal governorDurgadoss R
This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>