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path: root/drivers/thermal/cpuidle_cooling.c
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2020-10-12thermal/idle_inject: Fix comment of idle_duration_us and name of latency_nszhuguangqing
The comment of idle_duration_us and the name of latency_ns can be misleading, so fix them. Signed-off-by: zhuguangqing <zhuguangqing@xiaomi.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20200917073553.898-1-zhuguangqing83@gmail.com
2020-05-19thermal/drivers/cpuidle_cooling: Change the registration functionDaniel Lezcano
Today, there is no user for the cpuidle cooling device. The targetted platform is ARM and ARM64. The cpuidle and the cpufreq cooling device are based on the device tree. As the cpuidle cooling device can have its own configuration depending on the platform and the available idle states. The DT node description will give the optional properties to set the cooling device up. Do no longer rely on the CPU node which is prone to error and will lead to a confusion in the DT because the cpufreq cooling device is also using it. Let initialize the cpuidle cooling device with the DT binding. This was tested on: - hikey960 - hikey6220 - rock960 - db845c Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Tested-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20200429103644.5492-3-daniel.lezcano@linaro.org
2020-01-27thermal/drivers/cpu_cooling: Introduce the cpu idle cooling driverDaniel Lezcano
The cpu idle cooling device offers a new method to cool down a CPU by injecting idle cycles at runtime. It has some similarities with the intel power clamp driver but it is actually designed to be more generic and relying on the idle injection powercap framework. The idle injection duration is fixed while the running duration is variable. That allows to have control on the device reactivity for the user experience. An idle state powering down the CPU or the cluster will allow to drop the static leakage, thus restoring the heat capacity of the SoC. It can be set with a trip point between the hot and the critical points, giving the opportunity to prevent a hard reset of the system when the cpufreq cooling fails to cool down the CPU. With more sophisticated boards having a per core sensor, the idle cooling device allows to cool down a single core without throttling the compute capacity of several cpus belonging to the same clock line, so it could be used in collaboration with the cpufreq cooling device. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-2-daniel.lezcano@linaro.org