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path: root/drivers/thermal/Makefile
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2014-11-24thermal: rockchip: add driver for thermalCaesar Wang
Thermal is TS-ADC Controller module supports user-defined mode and automatic mode. User-defined mode refers,TSADC all the control signals entirely by software writing to register for direct control. Automaic mode refers to the module automatically poll TSADC output, and the results were checked.If you find that the temperature High in a period of time,an interrupt is generated to the processor down-measures taken;If the temperature over a period of time High, the resulting TSHUT gave CRU module,let it reset the entire chip, or via GPIO give PMIC. Signed-off-by: zhaoyifeng <zyf@rock-chips.com> Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com> Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20thermal: Add Tegra SOCTHERM thermal management driverMikko Perttunen
This adds support for the Tegra SOCTHERM thermal sensing and management system found in the Tegra124 system-on-chip. This initial driver supports temperature polling for four thermal zones. Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20thermal: introduce clock cooling deviceEduardo Valentin
This patch introduces a new thermal cooling device based on common clock framework. The original motivation to write this cooling device is to be able to cool down thermal zones using clocks that feed co-processors, such as GPUs, DSPs, Image Processing Co-processors, etc. But it is written in a way that it can be used on top of any clock. The implementation is pretty straight forward. The code creates a thermal cooling device based on a pair of a struct device and a clock name. The struct device is assumed to be usable by the OPP layer. The OPP layer is used as source of the list of possible frequencies. The (cpufreq) frequency table is then used as a map from frequencies to cooling states. Cooling states are indexes to the frequency table. The logic sits on top of common clock framework, specifically on clock pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is only allowed when the new rate is within the thermal limit (cooling state -> freq). When a thermal cooling device state transition is requested, the clock is also checked to verify if the current clock rate is within the new thermal limit. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Mike Turquette <mturquette@linaro.org> Cc: Nishanth Menon <nm@ti.com> Cc: Pavel Machek <pavel@ucw.cz> Cc: "Rafael J. Wysocki" <rjw@sisk.pl> Cc: Len Brown <len.brown@intel.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: linux-pm@vger.kernel.org Cc: linux-arm-kernel@lists.infradead.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-10-17Merge branch 'int340x-thermal' of .git into nextZhang Rui
2014-10-11Thermal: introduce int3403 thermal driverLan Tianyu
ACPI INT3403 device object can be used to retrieve temperature date from temperature sensors present in the system, and to expose device' performance control. The previous INT3403 thermal driver supports temperature reporting only, thus remove it and introduce this new & enhanced one. Signed-off-by: Lan Tianyu <tianyu.lan@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10Thermal: introduce int3400 thermal driverZhang Rui
Introduce int3400 thermal driver. And make INT3400 driver enumerate the other int340x thermal components shown in _ART/_TRT. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-08-27thermal: Added Bang-bang thermal governorPeter Feuerer
The bang-bang thermal governor uses a hysteresis to switch abruptly on or off a cooling device. It is intended to control fans, which can not be throttled but just switched on or off. Bang-bang cannot be set as default governor as it is intended for special devices only. For those special devices the driver needs to explicitely request it. Cc: Andrew Morton <akpm@linux-foundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Andreas Mohr <andi@lisas.de> Cc: Borislav Petkov <bp@suse.de> Cc: Javi Merino <javi.merino@arm.com> Cc: linux-pm@vger.kernel.org Signed-off-by: Peter Feuerer <peter@piie.net> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15thermal: sti: Introduce ST Thermal core codeLee Jones
This core is shared by both ST's 'memory mapped' and 'system configuration register' based Thermal controllers. Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com> Signed-off-by: Lee Jones <lee.jones@linaro.org> Acked-by: Pavel Machek <pavel@ucw.cz> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15thermal: Intel SoC DTS thermalSrinivas Pandruvada
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature sensors(DTS), in addition to the standard DTSs in the core. Also they support 4 programmable thresholds, out of which two can be used by OSPM. These thresholds can be used by OSPM thermal control. Out of these two thresholds, one is used by driver and one user mode can change via thermal sysfs to get notifications on threshold violations. The driver defines one critical trip points, which is set to TJ MAX - offset. The offset can be changed via module parameter (default 5C). Also it uses one of the thresholds to get notification for this temperature violation. This is very important for orderly shutdown as the many of these devices don't have ACPI thermal zone, and expects that there is some other thermal control mechanism present in OSPM. When a Linux distro is used without additional specialized thermal control program, BIOS can do force shutdown when thermals are not under control. When temperature reaches critical, the Linux thermal core will initiate an orderly shutdown. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git ↵Zhang Rui
into next
2014-01-02Thermal: ACPI INT3403 thermal driverSrinivas Pandruvada
The ACPI INT3403 device objects present on some systems can be used to retrieve temperature data from thermal sensors. Add a driver registering each INT3403 device object as a thermal zone device and exposing its _TMP, PATx and GTSH method via the standard thermal control interface under /sys/class/thermal/. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-12-04thermal: introduce device tree parserEduardo Valentin
This patch introduces a device tree bindings for describing the hardware thermal behavior and limits. Also a parser to read and interpret the data and feed it in the thermal framework is presented. This patch introduces a thermal data parser for device tree. The parsed data is used to build thermal zones and thermal binding parameters. The output data can then be used to deploy thermal policies. This patch adds also documentation regarding this API and how to define tree nodes to use this infrastructure. Note that, in order to be able to have control on the sensor registration on the DT thermal zone, it was required to allow changing the thermal zone .get_temp callback. For this reason, this patch also removes the 'const' modifier from the .ops field of thermal zone devices. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Mark Rutland <mark.rutland@arm.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03thermal: hwmon: move hwmon support to single fileEduardo Valentin
In order to improve code organization, this patch moves the hwmon sysfs support to a file named thermal_hwmon. This helps to add extra support for hwmon without scrambling the code. In order to do this move, the hwmon list head is now using its own locking. Before, the list used the global thermal locking. Also, some minor changes in the code were required, as recommended by checkpatch.pl. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-15Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui
2013-08-13thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap
This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: add imx thermal driver supportShawn Guo
This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-18Merge branch 'cpu-package-thermal' of .git into nextZhang Rui
Conflicts: drivers/thermal/Kconfig drivers/thermal/Makefile
2013-06-18Thermal: CPU Package temperature thermalSrinivas Pandruvada
This driver register CPU digital temperature sensor as a thermal zone at package level. Each package will show up as one zone with at max two trip points. These trip points can be both read and updated. Once a non zero value is set in the trip point, if the package package temperature goes above or below this setting, a thermal notification is generated. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28thermal: introduce TI SoC thermal driverEduardo Valentin
This patch moves the ti-soc-thermal driver out of the staging tree to the thermal tree. Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: Rob Landley <rob@landley.net> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Cc: J Keerthy <j-keerthy@ti.com> Cc: Radhesh Fadnis <radhesh.fadnis@ti.com> Cc: Cyril Roelandt <tipecaml@gmail.com> Cc: devicetree-discuss@lists.ozlabs.org Cc: linux-doc@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devel@driverdev.osuosl.org Cc: linux-pm@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-14Thermal: build cpu_cooling code into thermal_sys moduleZhang Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14Thermal: build thermal governors into thermal_sys moduleZhang Rui
The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14Thermal: rename thermal_sys.c to thermal_core.cZhang Rui
this is the preparation work to build all the thermal core framework source file, like governors, cpu cooling, etc, into one module. No functional change in this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-02thermal: Add driver for Armada 370/XP SoC thermal managementEzequiel Garcia
This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08Thermal: rename thermal governor Kconfig option to avoid generic namingZhang Rui
Currently, we have three Kconfig options for thermal governors, aka, CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE. But these names are too generic that may bring confusion to users. Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE, CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE to avoid the generic naming. Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08Thermal: Dove: Add Themal sensor support for Dove.Andrew Lunn
The Marvell Dove SoC has a thermal sensor. Add a driver using the thermal framework. Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08thermal: Add support for the thermal sensor on Kirkwood SoCsNobuhiro Iwamatsu
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor. Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06PM: Introduce Intel PowerClamp DriverJacob Pan
Intel PowerClamp driver performs synchronized idle injection across all online CPUs. The goal is to maintain a given package level C-state ratio. Compared to other throttling methods already exist in the kernel, such as ACPI PAD (taking CPUs offline) and clock modulation, this is often more efficient in terms of performance per watt. Please refer to Documentation/thermal/intel_powerclamp.txt for more details. Signed-off-by: Arjan van de Ven <arjan@linux.intel.com> Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15Thermal: Add ST-Ericsson DB8500 thermal driver.hongbo.zhang
This driver is based on the thermal management framework in thermal_sys.c. A thermal zone device is created with the trip points to which cooling devices can be bound, the current cooling device is cpufreq, e.g. CPU frequency is clipped down to cool the CPU, and other cooling devices can be added and bound to the trip points dynamically. The platform specific PRCMU interrupts are used to active thermal update when trip points are reached. Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com> Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15drivers/thermal/Makefile refactorZhang Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Add a thermal notifier for user spaceDurgadoss R
This patch registers a governor which will let the user land manage the platform thermals. Whenever a trip happens, this governor just notifies the user space using kobj_uevent(). Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Introduce a step_wise thermal governorDurgadoss R
This patch adds a simple step_wise governor to the generic thermal layer. This algorithm throttles the cooling devices in a linear fashion. If the 'trend' is heating, it throttles by one step. And if the thermal trend is cooling it de-throttles by one step. This actually moves the throttling logic from thermal_sys.c and puts inside step_wise.c, without any change. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05Thermal: Introduce fair_share thermal governorDurgadoss R
This patch introduces a simple 'weight' based governor named fair_share governor. Whenever the thermal framework gets notified of the trip point violation, this governor (if configured), throttles the cooling devices associated with a thermal zone. This mapping between a thermal zone and a cooling device and the effectiveness of cooling are provided in the platform layer. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24hwmon: exynos4: move thermal sensor driver to driver/thermal directoryAmit Daniel Kachhap
This movement is needed because the hwmon entries and corresponding sysfs interface is a duplicate of utilities already provided by driver/thermal/thermal_sys.c. The goal is to place it in thermal folder and add necessary functions to use the in-kernel thermal interfaces. Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Acked-by: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add generic cpufreq cooling implementationAmit Daniel Kachhap
This patchset introduces a new generic cooling device based on cpufreq that can be used on non-ACPI platforms. As a proof of concept, we have drivers for the following platforms using this mechanism now: * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal) There is a small change in cpufreq cooling registration APIs, so a minor change is needed for Freescale platforms. Brief Description: 1) The generic cooling devices code is placed inside driver/thermal/* as placing inside acpi folder will need un-necessary enabling of acpi code. This code is architecture independent. 2) This patchset adds generic cpu cooling low level implementation through frequency clipping. In future, other cpu related cooling devices may be added here. An ACPI version of this already exists (drivers/acpi/processor_thermal.c) .But this will be useful for platforms like ARM using the generic thermal interface along with the generic cpu cooling devices. The cooling device registration API's return cooling device pointers which can be easily binded with the thermal zone trip points. The important APIs exposed are, a) struct thermal_cooling_device *cpufreq_cooling_register( struct cpumask *clip_cpus) b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) 3) Samsung exynos platform thermal implementation is done using the generic cpu cooling APIs and the new trip type. The temperature sensor driver present in the hwmon folder(registered as hwmon driver) is moved to thermal folder and registered as a thermal driver. A simple data/control flow diagrams is shown below, Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor | | \|/ | Cpufreq cooling device <--------------- TODO: *Will send the DT enablement patches later after the driver is merged. This patch: Add support for generic cpu thermal cooling low level implementations using frequency scaling up/down based on the registration parameters. Different cpu related cooling devices can be registered by the user and the binding of these cooling devices to the corresponding trip points can be easily done as the registration APIs return the cooling device pointer. The user of these APIs are responsible for passing clipping frequency . The drivers can also register to recieve notification about any cooling action called. [akpm@linux-foundation.org: fix comment layout] Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: SangWook Ju <sw.ju@samsung.com> Cc: Durgadoss <durgadoss.r@intel.com> Cc: Len Brown <lenb@kernel.org> Cc: Jean Delvare <khali@linux-fr.org> Cc: Kyungmin Park <kmpark@infradead.org> Cc: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24thermal: add Renesas R-Car thermal sensor supportKuninori Morimoto
This patch add basic Renesas R-Car thermal sensor support. It was tested on R-Car H1 Marzen board. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Cc: Len Brown <len.brown@intel.com> Cc: Joe Perches <joe@perches.com> Cc: Jean Delvare <khali@linux-fr.org> Cc: Guenter Roeck <guenter.roeck@ericsson.com> Cc: Magnus Damm <magnus.damm@gmail.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-03-22thermal: add support for thermal sensor present on SPEAr13xx machinesVincenzo Frascino
ST's SPEAr13xx machines are based on CortexA9 ARM processors. These machines contain a thermal sensor for junction temperature monitoring. This patch adds support for this thermal sensor in existing thermal framework. [akpm@linux-foundation.org: little code cleanup] [akpm@linux-foundation.org: print the pointer correctly] [viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR] Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Viresh Kumar <viresh.kumar@st.com> Signed-off-by: Andrew Morton <akpm@linux-foundation.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: re-name thermal.c to thermal_sys.cLen Brown
thermal_sys was already the name of the resulting module, and it is built from this one source file. Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29thermal: add the support for building the generic thermal as a moduleZhang Rui
Build the generic thermal driver as module "thermal_sys". Make ACPI thermal, video, processor and fan SELECT the generic thermal driver, as these drivers rely on it to build the sysfs I/F. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Jean Delvare <khali@linux-fr.org> Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01the generic thermal sysfs driverZhang Rui
The Generic Thermal sysfs driver for thermal management. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Thomas Sujith <sujith.thomas@intel.com> Signed-off-by: Len Brown <len.brown@intel.com>