| Age | Commit message (Collapse) | Author | |
|---|---|---|---|
| 2013-04-09 | ARM: dts: omap3: Add support for IGEP COM Module | Javier Martinez Canillas | |
| ISEE IGEP COM Module is an TI OMAP3 SoC computer on module. This patch adds an initial device tree support to boot an IGEP COM Module from the MMC/SD. Signed-off-by: Javier Martinez Canillas <javier.martinez@collabora.co.uk> Tested-by: Enric Balletbo i Serra <eballetbo@gmail.com> [b-cousson@ti.com: Update the Makefile for 3.8-rc2] Signed-off-by: Benoit Cousson <benoit.cousson@linaro.org> | |||
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